Infineon TC277TP64F200NDCKXUMA1

TriCore™200 МГц4 МБ (4M x 8)

Overview

TC275T64F200WCAKXUMA1 with pin details, that includes AURIX? Series, they are designed to operate with a Digi-ReelR Alternate Packaging Packaging, Package Case is shown on datasheet note for use in a 176-LQFP Exposed Pad, it has an Operating Temperature range of -40°C ~ 125°C (TA), Supplier Device Package is designed to work in PG-LQFP-176-22, as well as the 112 Number of I O, the device can also be used as 200MHz Speed. In addition, the EEPROM Size is 64K x 8, the device is offered in TriCore? Core Processor, the device has a 472K x 8 of RAM Size, and Program Memory Type is FLASH, and the Peripherals is DMA, and Connectivity is ASC, CAN, Ethernet, FlexRay, HSSL, I2C, LIN, MSC, PSI5, QSPI, SENT, and the Voltage Supply Vcc Vdd is 3 V ~ 5.5 V, and Core Size is 32-Bit, and the Program Memory Size is 4MB (4M x 8), and Data Converters is A/D 60x12b, 6 x Sigma-Delta, and the Oscillator Type is External, and Part # Aliases is CA SAK-TC275T-64F200W SP001106358.

TC2-72T+ with EDA / CAD Models manufactured by MINI. The TC2-72T+ is available in Transformer Package, is part of the IC Chips.

Features

• Triple TriCore with 200MHz and DSP functionality (three high-performance 32-bit super-scalar TriCore V1.6.1 CPUs running at 200 MHz in the full automotive temperature range)

• Up to 4MB Flash w/ ECC protection (dedicated closely coupled memory areas per core)

• 64 KB EEPROM at 500 k cycles

• 472KB RAM w/ ECC protection

• 64x DMA channels

• Sensor interfaces : 10xSENT, 3xPSI5, 1xPSI5S 

• State-of-the-art connectivity : 1xEthernet 100 Mbit , 1x FlexRay ,4xASCLIN, 4xQSPI, 1xI2C , 2xMSC , 1xHSSL, I2S emulation , 5xCAN including  data rate enhanced CAN FD 

• Programmable HSM  (Hardware Security Module)

• Single voltage supply 5V or 3.3V

• LFBGA-292 package 

• Ambient Temperaure range -40°C~+125°C

Applications

• Industrial applications

• Safety applications

• Connectivity Applications

• Transportation applications

• Powertrain applications

• (H)EV applications