NXP MK64FN1M0VLL12R

ARM® Cortex®-M4120 МГц1 МБ (1М x 8)

Overview

MK64FN1M0VLL12 with pin details, that includes Kinetis K60 Series, they are designed to operate with a MCU Product, Packaging is shown on datasheet note for use in a Tray Alternate Packaging, that offers Unit Weight features such as 0.024170 oz, Mounting Style is designed to work in SMD/SMT, as well as the 100-LQFP Package Case, it has an Operating Temperature range of -40°C ~ 105°C (TA). In addition, the Supplier Device Package is 100-LQFP (14x14), the device is offered in 66 Number of I O, the device has a 120MHz of Speed, and Core Processor is ARMR CortexR-M4, and the RAM Size is 256K x 8, and Program Memory Type is FLASH, and the Peripherals is DMA, I2S, LVD, POR, PWM, WDT, and Connectivity is CAN, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG, and the Voltage Supply Vcc Vdd is 1.71 V ~ 3.6 V, and Core Size is 32-Bit, and the Program Memory Size is 1MB (1M x 8), and Data Converters is A/D 32x16b, D/A 1x12b, and the Oscillator Type is Internal, it has an Maximum Operating Temperature range of + 105 C, it has an Minimum Operating Temperature range of - 40 C, and Operating Supply Voltage is 1.71 V to 3.6 V, and the Interface Type is CAN I2C I2S UART SDHC SPI, and Core is ARM Cortex M4, and the Processor Series is ARM, and Data Bus Width is 32 bit, and the Maximum Clock Frequency is 120 MHz, and Number of ADC Channels is 2, and the Number of I Os is 66 I/O, and Data RAM Size is 256 kB, and the ADC Resolution is 16 bit, and Data RAM Type is Flash, and the Data ROM Type is EEPROM.

MK64FN1M0VDC12 with circuit diagram, that includes CAN, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Connectivity, they are designed to operate with a ARMR CortexR-M4 Core Processor, Core Size is shown on datasheet note for use in a 32-Bit, that offers Data Converters features such as A/D 37x16b, D/A 2x12b, Number of I O is designed to work in 83, it has an Operating Temperature range of -40°C ~ 105°C (TA), the device can also be used as Internal Oscillator Type. In addition, the Package Case is 121-XFBGA, the device is offered in Tray Packaging, the device has a DMA, I2S, LVD, POR, PWM, WDT of Peripherals, and Program Memory Size is 1MB (1M x 8), and the Program Memory Type is FLASH, and RAM Size is 256K x 8, and the Series is Kinetis K60, and Speed is 120MHz, and the Supplier Device Package is 121-MAPBGA (8x8), and Unit Weight is 0.001901 oz, and the Voltage Supply Vcc Vdd is 1.71 V ~ 3.6 V.

Features

• Ultra-Low-Power

  Full memory and analog operation down to 1.71 volts for extended battery life

  Low-power timer for continual system operation in reduced power state

  Flexible low-power modes with power and clock gating for optimal peripheral activity and recovery times.

  Low-leakage wake-up unit with up to seven internal modules and 16 pins as wake-up sources in low-leakage stop (LLS)/very low-leakage stop (VLLS) modes

• Flash, SRAM, and FlexMemory

  256 KB of SRAM

  Up to 1 MB flash. Fast access, high reliability with four-level security protection

  FlexMemory: Up to 4 KB of user-segmentable byte write/erase EEPROM for data tables/system data. EEPROM with over 10M cycles and flash with 70 μsec write time (brownouts without data loss/corruption). No user or system intervention to complete programming and erase functions and full operation down to 1.71 volts. In addition, up to 128KB of FlexNVM for extra program code, data or EEPROM backup

• Mixed-Signal Capability
  

  Two 12-bit digital-to-analog converters (DACs) for analog waveform generation for audio applications

  Three high-speed comparators providing fast and accurate motor over-current protection by driving PWMs to a safe state

  Analog voltage reference provides an accurate reference to analog blocks, ADC and DAC, and replaces external voltage references to reduce system cost

  Two high-speed, 16-bit analog-to-digital converters (ADCs) with configurable resolution. Single or operation for improved noise rejection. 500 ns conversion time  achievable with programmable delay block triggering

• Performance

  Cross bar switch enables concurrent multi-master bus accesses, increasing bus bandwidth

  Up to 16-channel DMA for peripheral and memory servicing with reduced CPU loading and faster system throughput

  ARM Cortex-M4 core + DSP. 120 MHz, single-cycle MAC, single instruction multiple data (SIMD) extensions, single precision floating point unit

  Independent flash banks allow concurrent code execution and firmware updating with no performance degradation or complex coding routines

• Timing and Control

  Carrier modulator timer for infrared waveform generation in remote control applications

  Up to four FlexTimers with a total of 20 channels. Hardware dead-time insertion and quadrature decoding for motor control

  Four-channel 32-bit periodic interrupt timer provides time base for RTOS task scheduler or trigger source for ADC conversion and programmable delay block

• Human-Machine Interface (HMI)

  GPIO with pin interrupt support

Applications

• Industrial

• Enterprise systems

• Communications equipment