NXP FXLS93230AESR2

I²C, SPI-40°C ~ 125°C

Overview

The 93240-206HLF is BERGSTIK II DR R/A RET, that includes Black Color, they are designed to operate with a BERGSTIKR II, MezzSelect?, Basics+ Series, Packaging is shown on datasheet note for use in a Bulk, that offers Termination features such as Kinked Pin, Solder, Mounting Type is designed to work in Through Hole, Right Angle, as well as the Header, Unshrouded Connector Type, the device can also be used as Gold or Gold, GXT? Contact Finish. In addition, the Contact Finish Thickness is 15μin (0.38μm), the device is offered in 6 Number of Positions, the device has a All of Number of Positions Loaded, and Pitch is 0.100" (2.54mm), and the Number of Rows is 2, and Contact Type is Male Pin, and the Row Spacing is 0.100" (2.54mm), and Contact Mating Length is 0.338" (8.59mm).

9324/6/5 with EDA / CAD Models, that includes UHMW Polyethylene Backing Carrier, they are designed to operate with a Roll Packaging, Tape Type is shown on datasheet note for use in a Masking, that offers Color features such as Black, Usage is designed to work in Automotive, as well as the Acrylic Adhesive, the device can also be used as 9324 Series. In addition, the Width is 6.00" (152.40mm) 1/2', the device is offered in -30 ~ 225°F (-34 ~ 107°C) Temperature Range, the device has a 15' (4.6m) 5 yds of Length, and Thickness is 0.0065" (6.5 mils, 0.165mm), and the Thickness Backing Carrier Liner is 0.0050" (5.0 mils, 0.127mm), and Thickness Adhesive is 0.0015" (1.5 mils, 0.038mm).

Features